The coefficient of thermal expansion ( CTE ) is very important for studies of composite and thermo - mechanical analysis.
本文采用激光散斑干涉法测量微电子金属封装用金属复合 引线 的热膨胀系数.
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As CTE mismatch of materials, it is possible that chips crack in thermal stress lumped rigion.
并且由于环氧模塑封材料 、 芯片之间的热膨胀系数失配,芯片热应力集中区域有发生脱层开裂的可能性.
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